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Shanghai Huitian New Material Co., Ltd
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5297 Two-Part Addition-Type Potting Adhesive 1.5 W/M·K Thermal Conductive Flame Retardant

5297 Two-Part Addition-Type Potting Adhesive 1.5 W/M·K Thermal Conductive Flame Retardant

5297 Two-Part Addition-Type Potting Adhesive 1.5 W/M·K Thermal Conductive Flame Retardant

Product Details:
Place of Origin: China
Brand Name: Huitian
Certification: UL RoHS
Model Number: 5297
Detail Information
Place of Origin:
China
Brand Name:
Huitian
Certification:
UL RoHS
Model Number:
5297
Chemical Composition:
SIlicone
Part A Appearance:
Grey Fluid
Part B Appearance:
White Fluid
Part A Viscosity:
3,500-4,500 MPa·s
Part B Viscosity:
3,000-4,000 MPa·s
Part A Density:
2.55±0.05 G/cm³
Part B Density:
2.55±0.05 G/cm³
Mix Ratio:
1:1
Operating Time:
>30 Mins
Gel Time @25℃:
≤3 H
Gel Time @80℃:
30 Mins
Hardness (shore A):
30-40
Volume Resistivity:
≥1.0×10^14 Ω·cm
Thermal Conductivity:
1.5 W/m·K
Trading Information
Minimum Order Quantity:
500KG
Price:
Negotiation
Packaging Details:
20kg/barrel
Delivery Time:
5-8 days
Payment Terms:
L/C, T/T
Supply Ability:
2000T/Month
Product Description

5297(A7B7) TDS-EN.pdf

 

 

 

5297 is a 1:1 two-component addition-type potting silicone rubber, with 1.5 W /m·K thermal conductive, flame retardant.

 

 

Applications
All kinds of electrical components of thermal conductivity, flame retardant potting, such as photovoltaic inverters, LED drive power.charging piles, automotive electronics, NEV power, controllers etc.

 

Product Features

1) High thermal conductivity and flowability

2) Both room temperature and heat curing

3) Good weather and aging resistance

4) Excellent insulation properties

5) Flame retardant UL94V-0

6) Maintains rubber elasticity from -50°C to 200°C

7) RoHS Directive

 

Technical parameters

Reference standard1 Item Unit Value
Properties before curing (25±2, 60±5%RH)
Q/HTXC 2 Appearance (A) - Grey fluid
  Appearance (B) - White fluid
GB/T2794 Viscosity (A) mPa·s 3,500-4,500
  Viscosity (B) mPa·s 3,000-4,000
GB/T13354 Viscosity (A) g/cm3 2.55±0.05
  Viscosity (B) g/cm3 2.55±0.05
Properties after curing (25±2, 60±5%RH, A:B=1:1)
Q/HTXC 2 Operating time min >30
Q/HTXC 2 Curing time (25℃) h ≤3
Q/HTXC 2 Curing time (80℃) min 30
GB/T 531 Hardness (Shore A) -- 30-40
Q/HTXC 2 Dielectric strength KV/mm ≥18
Q/HTXC 2 Volume resistivity Ω·cm ≥1.0×1014
GB/T 528-92 Tensile Strength MPa 0.94
GB/T 528-92 Elongation % 56
GB/T 7124 Shear Strength MPa 0.7
GB/T 1034 Water absorption % <0.1
ISO 22007-2 Thermal conductivity W/(m·K) 1.5±0.1
ASTM E831 CLTE @25-150℃ μm/(m·℃) 162.6
 

 

 

Cautions
Store the product in a sealed container, and keep it away from children for storage.

The glue will not cure if exposed to a certain amount of the following chemicals:

Organic compounds of N, P, and S, ionic compounds of Sn, Pb, Hg, As, etc.;

Compounds containing alkyne and polyvinyl.

To avoid the above problem, Any residual rosin on the circuit board should be wiped clean when using the glue, and use soldering tin with low lead content.

This product is non-hazardous. Please consult the MSDS of the product for safety information.

 

Packaging

20kg/barrel

5297 Two-Part Addition-Type Potting Adhesive 1.5 W/M·K Thermal Conductive Flame Retardant 0

Huitian Addition-type potting production line

 

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