|Place of Origin:||CHINA|
|Minimum Order Quantity:||50KG|
|Packaging Details:||2kg/bucket,6 buckets/carton|
|Payment Terms:||L/C, T/T|
|Supply Ability:||1000KG MONTH|
|Physical Form:||Paste||Color:||White Or Black|
|Heat Conductivity Coefficient:||2.1|
● Product Features:
Ø Single component, white color.
Ø Physical form: paste
Ø Made of metallic oxide and polysiloxane
Ø Wide operating temperature range
Ø Nontoxic, non-corrosive
Ø Eco-friendly, odorless
Ø Doesn’t go dry and flowing at high temperature.
Ø High performance on insulation, damp proofing, corona resistance, electric leakage resistance and chemical resistance.
Ø Can be dispensed both by hand or machine.
Ø Heat conductivity coefficient: 2.1W/(m·K)
● Main Applications:
Ø Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
Ø For the filling of gap between high-power audion, thyrister and basic materials such as copper and aluminum to reduce the temperature of electronic components.
● How to Use
Ø Stir this product before using if it’s long time unused.
Ø Clean the object surfaces to get rid of oil and dirty before use.
Ø The object surfaces should be even and uniform.
Ø To dispense smoothly, please stir for 2 minutes before use.
Ø Apply a little for try before massive use.
Ø Only a thin layer of this product needed for use to avoid wastes.
Ø Do not keep this product exposed in the air for a long time.
● Technical Data:
|0.1mm Thermal Resistance||m2K/W||0.00011|
|Heat Conductivity Coefficient||W/(m·K)||2.1|
Ø 2kg/bucket, 6bukets/carton
Ø Store it in dry and shady places at the temperature of 8~28℃
Ø Storage life is 12 months from the date of manufacture.
Ø Keep it away from children.
Ø In case of contact with skins, wipe and then flush with clear water.
Ø In case of contact with eyes, flush with clear water immediately and go to hospital for checking.
Ø For the use of this product, it’s not the more the better but the thinner the better under the condition
of full filling of gaps is assured.