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6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound

6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound

6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound

Product Details:

Place of Origin: China
Brand Name: Huitian
Model Number: 6202

Payment & Shipping Terms:

Minimum Order Quantity: 10 SET
Price: USD 12 KG
Packaging Details: 41kg/Set A component 32kg/bucket. B component 9kg/bucket
Delivery Time: 8-15 DAYS
Payment Terms: L/C, T/T
Supply Ability: 3000 KG MONTH
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Detailed Product Description
Color: B Yellow Density G/cm3: B 1.15
Viscosity Mpa.s: B 60 Weight Ratio: A:B =100:28
Volume Ratio: A:B =100:44 Operation Time 130g GB/T 7123.1-2002): ≥75

6202 (HT6202T) double component heat curing epoxy potting adhesive is for Automobile ignition coil potting

 

202 (HT6202T) double component heat curing epoxy potting adhesive is two components, heating curing, translucent, automobile ignition coil epoxy adhesive. Low viscosity, easy penetration of defoaming, permeability is good, cracking resistance is good , insulating property good, high temperature resistant.

 

Typical Applications

Automobile ignition coil potting

 

Characteristic before curing

  Representative value range

  A component

Color Grey

Density g/cm3(25℃) 1.85 1.82~1.88

(GB/T13354-1992)

Viscosity mpa.s(25℃)400000 300000~500000

GB/T 2794-1995

B component

Color Yellow

Density g/cm3(25℃) 1.15 1.10~1.20

(GB/T13354-1992)

Viscosity mpa.s(40℃) 60 40~70

(GB/T 2794-1995)

 

Characteristic after mixing

Color Grey

Weight ratio A:B =100:28

Volume ratio A:B =100:44

Operation time 130g GB/T 7123.1-2002) ≥75

Condition of cure min(90℃,130g) 90℃@3h+130℃@3h

 

Characteristic after curing

Harness: Shore-D(GB/T 531-1999) 92

Glass-transition temperature℃ 142

GB/T 11998-1989

Volume Resistivity Ω·cm(25℃) 1.0×1015

GB/T1692-1992

Dielectric Strength KV/mm(25℃)(GB/T1692-1992) ≥25

Bending strength: Mpa 105

shock strength KJ/m2,(GB/T 1843-2008) 2.7

Shear strength Mpa(GB/T13930)≥7

Dielectric constant(25℃,1.2MHz,GB/T1692-1992)3.8

dielectric dissipation factor(25℃,1.2MHz) 0.012

GB/T1692-1992

Thermal conductivity W/m.K(25℃)(GB/T 11025-1989) 0.6

water absorption %(ISO 62) <0.1

Work Temperature℃ -40~150

 

Direction for use

1. 1 glue injection: 90 ~ 100 ℃ preheated A component 2~3 hour(make sure adhesive hot enough, viscosity is low),Stir evenly inhaled or into the vacuum tank with agitator (Semi automatic filling and sealing potting process must first accurate weighing A component and then poured into tank). 80 ~ 90 ℃ while stirring vacuum for 2 to 3 hours(to no bubbles),keep warm and waiting to use.

A. semi automatic filling and sealing process: accurate weighing in component B, A:B =100:28,poured into which vacuum tank loaded accurately weighing A components,60 ~ 65 ℃ while stirring vacuum for 30 minutes,until no bubbles. Potting process begin, after potting Put in the oven to curing.

B. Automatic filling and sealing process:poured B component into which vacuum tank loaded accurately weighing A components, 35 ~ 45 ℃ while stirring vacuum for 30 minutes. Then adjust the A component and the B component of the discharge ratio(Weight ratio A:B =100:28;Volume ratio A:B =100:44),after ratio adjust, start inject adhesive,keep the temperature 60~65℃.After adhesive injection, put in the oven to curing.

2.Curing:put in 90℃ oven 3 hours, and slowly warming up to 130℃(warming up time keep in 30~40 minutes),curing in 130℃ 2.5~3 hours,after curing slowly cooling to 50℃, and take it out of oven(cooling time keep in 60 minutes).

 

Attention

Every time mix adhesive need keep in 5-10KGS,mixed adhesive should finish used in 1 hour. The Vacuum degree of vacuum tank and vacuum room should as low as possible.

 

Packing

41kg/Set

A component 32kg/bucket. B component 9kg/bucket

 

Storage

Store it in dry and shady places at the temperature of 8~28℃.Storage life 12 months

Contact Details
Shanghai Huitian New Material Co., Ltd

Contact Person: Mr. Jason Zhang

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