Send Message
Shanghai Huitian New Material Co., Ltd
Created with Pixso.
quote
Created with Pixso. Home > Products >
Electronic Adhesive Glue
>

Silicone Thermal Conductive Grease 0111 thermal grease for cpu or LED chip

Silicone Thermal Conductive Grease 0111 thermal grease for cpu or LED chip

Silicone Thermal Conductive Grease 0111 thermal grease for cpu or LED chip

Product Details:
Place of Origin: China
Brand Name: HUITIAN
Certification: SGS
Model Number: 0111
Detail Information
Place of Origin:
China
Brand Name:
HUITIAN
Certification:
SGS
Model Number:
0111
Physical Form:
Paste
Color:
White
Main Component:
Polysiloxane
Density:
2.5
Volatility(200℃,24h):
0.2
Heat Conductivity Coefficient:
1.2 W/(m•K)
Work Temperature:
-50~200
High Light:
silicone thermal grease , high performance thermal compound
Trading Information
Minimum Order Quantity:
250KG
Price:
Negotiation
Packaging Details:
2kg/bucket,6 buckets/carton
Delivery Time:
5-8 WORK DAYS
Payment Terms:
T/T, L/C
Supply Ability:
5000 KG MONTH
Product Description

Product Features:

 

Ø Single component, white color.

Ø Physical form: paste

Ø Made of metallic oxide and polysiloxane

Ø Wide operating temperature range

Ø Nontoxic, non-corrosive

Ø Eco-friendly, odorless

Ø Doesn’t go dry and flowing at high temperature.

Ø High performance on insulation, damp proofing, corona resistance, electric leakage resistance and chemical resistance.

Ø Can be dispensed both by hand or machine.

Ø Heat conductivity coefficient: 1.2 W/(m·K)

 

● Technical Data:

Item Unit Typical Value
Item No.   0111
Physical Form   paste
Color   white
Main Component   polysiloxane
Density g/cm3 2.5
Penetration Degree 1/10cm 330
Volatility(200,24h) % 0.2
Volume Resistivity Ω*cm 1.0×1015
Dielectric Strength KV/mm 24
Breakdown Voltage KV/mm 20
Surface Resistance Ω 2.5×1014
0.1mm Thermal Resistance m2K/W 0.00015
Work Temperature -50~200
Heat Conductivity Coefficient W/(m·K) 1.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Main Applications:

Ø Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.

Ø For the filling of gap between high-power audion, thyrister and basic materials such as copper and aluminum to reduce the temperature of electronic components.

 

How to Use

Ø Stir this product before using if it’s long time unused.

Ø Clean the object surfaces to get rid of oil and dirty before use.

Ø The object surfaces should be even and uniform.

Ø To dispense smoothly, please stir for 2 minutes before use.

Ø Apply a little for try before massive use.

Ø Only a thin layer of this product needed for use to avoid wastes.

Ø Do not keep this product exposed in the air for a long time.

 

Packing:

Ø 2kg/bucket, 6buckets/carton

Created with Pixso.
download Created with Pixso.