Brand List
0112G High Performance Silicone Thermal Grease corona resistance Thermal Conductivity 1.35W/(m•K)
0112G TDS-EN.pdf
0112G is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product features:
One-component, white;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance, and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity: ≥1.35W/m·K
Item
Unit
Typical Value
Item No.
0112G
Physical Form
paste
Color
white
Main Component
polysiloxane
Density
g/cm 3
2.65
Penetration Degree
1/10cm
300
Volatility(200℃,24h)
%
0.2
Volume Resistivity
Ω*cm
1.0×10 15
Dielectric Strength
KV/mm
24
Breakdown Voltage
KV/mm
20
Surface Resistance
Ω
2.5×10 14
0.1mm Thermal Resistance
m 2 K/W
0.00014
Work Temperature
℃
-40~200
Heat Conductivity Coefficient
W/(m·K)
≥1.35
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.
Packing:
2kg/bucket, 6buckets/carton
Storage:
Store it in dry and cool places at the temperature of 0~35°C
Shelf life is 12 months
0115 High Performance Thermal Grease Gap Filler For CPU And Led Chip Nontoxic, Non-Corrosive To PCB And Metal 3.6W/M·K
0115 TDS-EN.pdf
0115 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product Features:
One-component, grey;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odorless;
Its stability and thermal conductivity kept even at the temperature of 150°C, also can be manually glued
Maintain dry and flowing at high temperature;
Thermal conductivity: 3.6W/m·K
Main Applications
Widely used for the thermal conductivity of electronic components including the filling of gaps between CPU, BGA, LED, power source, high-power audion, thyristor, and basic materials such as copper and aluminum to reduce the temperature of electronic components.
Item
Unit
Typical Value
Item No.
0115
Physical Form
paste
Color
grey
Main Component
polysiloxane
Density
g/cm 3
2.5
Penetration Degree
1/10cm
300
Volatility(200℃,24h)
%
0.2
Volume Resistivity
Ω*cm
1.0×10 11
Dielectric Strength
KV/mm
20
Breakdown Voltage
KV/mm
17
Surface Resistance
Ω
1.2×10 12
0.1mm Thermal Resistance
m 2 K/W
0.00004
Heat Conductivity Coefficient
W/(m·K)
3.6
Packing:
1kg/bucket, 12buckets/carton
Storage:
Store it in dry and cool places at the temperature of 0~35℃
Shelf life is 12 months
0114 Grey Silicone Thermal Conductive Grease 2.6W/M·K For Thermal Conductivity of Electronic Components
0114 TDS-EN.pdf
0114 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product Features:
One-component, grey;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odourless;
Its stability and thermal conductivity kept even at the temperature of 150°C, also can be manually glued
Maintain dry and flowing at high temperature;
Thermal conductivity: 2.6W/m·K
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gaps between CPU, BGA, LED, power source, high-power audion, thyristor, and basic materials such as copper and aluminum to reduce the temperature of electronic components.
Item
Unit
Typical Value
Item No.
0114
Physical Form
paste
Color
grey
Main Component
polysiloxane
Density
g/cm 3
2.5
Penetration Degree
1/10cm
290
Volatility(200℃,24h)
%
0.2
Volume Resistivity
Ω*cm
1.0×10 15
Dielectric Strength
KV/mm
22
Breakdown Voltage
KV/mm
18
Surface Resistance
Ω
1.6×10 12
0.1mm Thermal Resistance
m 2 K/W
0.00007
Heat Conductivity Coefficient
W/(m·K)
2.6
Packing:
1kg/bucket, 12buckets/carton
Storage:
Store it in dry and cool places at the temperature of 0~35℃
Shelf life is 12 months
0111 Silicone Thermal Conductive Grease Gap Filler For CPU or LED Chip Thermal conductivity 1.2W/m·K
0111 TDS-EN.pdf
0111 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product Features:
One-component, white;
Wideworkingtemperaturerange;
Nontoxic,non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance, and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity:1.2W/m·K
Item
Unit
Typical Value
Item No.
0111
Physical Form
paste
Color
white
Main Component
polysiloxane
Density
g/cm 3
2.5
Penetration Degree
1/10cm
330
Volatility(200℃,24h)
%
0.2
Volume Resistivity
Ω*cm
1.0×10 15
Dielectric Strength
KV/mm
24
Breakdown Voltage
KV/mm
20
Surface Resistance
Ω
2.5×10 14
0.1mm Thermal Resistance
m 2 K/W
0.00015
Work Temperature
℃
-50~200
Heat Conductivity Coefficient
W/(m·K)
1.2
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
For the filling of the gap between high-power audion, thyristors, and basic materials such as copper and aluminum to reduce the temperature of electronic components.
Packing:
1kg/bucket, 12bukets/carton
Storage:
Store it in dry and cool places at the temperature of 0~35℃
Shelf life is 12 months
0112 Silicone Thermal Grease Eco-Friendly Odorless Gap Filler For CPU Or LED Chip Thermal Conductivity 1.6W/M·K
0112 TDS-EN.pdf
0112 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product Features:
One-component, white;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity: 1.6W/m·K
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.
Item
Unit
Typical Value
Item No.
0112
Physical Form
paste
Color
white
Main Component
polysiloxane
Density
g/cm 3
2.7
Penetration Degree
1/10cm
310
Volatility(200℃,24h)
%
0.2
Volume Resistivity
Ω*cm
1.0×10 15
Dielectric Strength
KV/mm
24
Breakdown Voltage
KV/mm
20
Surface Resistance
Ω
2.5×10 14
0.1mm Thermal Resistance
m 2 K/W
0.00014
Work Temperature
℃
-50~200
Heat Conductivity Coefficient
W/(m·K)
1.6
Packing:
2kg/bucket, 800g/tube, 5kg/bucket
Storage:
Store it in dry and cool places at the temperature of 0~35℃
Shelf life is 12 months
0113 Thermal Conductive Grease Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal 2.1W/m·K
0113 TDS-EN.pdf
0113 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product Features:
One-component, white;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance, and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity: 2.1W/m·K
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.
Item
Unit
Typical Value
Item No.
0113
Physical Form
paste
Color
white
Main Component
polysiloxane
Density
g/cm 3
2.9
Penetration Degree
1/10cm
280
Volatility(200℃,24h)
%
0.2
Volume Resistivity
Ω*cm
1.0×10 15
Dielectric Strength
KV/mm
24
Breakdown Voltage
KV/mm
20
Surface Resistance
Ω
2.4×10 14
0.1mm Thermal Resistance
m 2 K/W
0.00011
Work Temperature
℃
-50~200
Heat Conductivity Coefficient
W/(m·K)
2.1
Packing:
2kg/bucket, 6bukets/carton
Storage:
Store it in dry and cool places at the temperature of 0~35℃
Shelf life is 12 months
7815 High Water Resistance Butyl Adhesive For Photovoltaic Modules Preventing Module Failure
7815 TDS-EN.pdf
7815 is one-part hot-melt butyl rubble. It features excellent water vapor barrier property and good weatherability. Suitable for machine dispensing. Solvent-free.
Product features
1) Extremely low water vapor transmission rate
2) Low volatile matters
3) Good adhesion to glass
4) Fast dispensing, suitable for machine dispensing
Applications
Auxiliary to conventional sealant use, greatly reducing module water vapor
Suitable for waterproof sealing of solar module edge
Packaging
55 gallons/Barrel
3515 UV Ribbon Bonding Adhesive For Photovoltaic Cells Bonding Instead Of Welding
3515 TDS-EN.pdf
3515 is a one-component, solvent-free, UV-curable fixing glue, its chemical composition is modified polyurethane acrylic resin, featuring low-odor, environmentally friendly, medium viscosity, and high thixotropy, shape retention. Can have excellent yellowing resistance, high strength, and excellent insulation.
Product features
1) 365nm UV LED light source curing, fast curing
2) Solvent-free, economical and environmentally-friendly
3) Medium viscosity, high thixotropy, excellent shape retention
4) Excellent yellowing resistance, high strength, high adhesion
Applications
Suitable for electronic components fixing, wire soldering reinforcement, connector bonding, and fixing
Suitable for bonding of welding strip and solar cell
Packaging
300 cc/cartridge
PV331S Ultra High Water Resistant Backsheet HJT Requirements Encapsulation Of Crystalline Silicon Photovoltaic Modules
PV331S TDS-EN.pdf
PV331S is a Huitian self-developed backsheet made of different thicknesses of polyvinylidene fluoride film (PVDF film) as weather resistant layer, enhanced high resistance biaxially oriented transparent polyester film (PET) as a support layer, and fluorocarbon coating as EVA bonding layer, which is laminated by adhesive, with black and white color options.
Product Features
1) Ultra-high water vapor resistance <0.3g/㎡·day
2) Double-sided fluorine coating design, high heat resistance, high reliability
3) Transparent product, after UV300kWh/㎡, DH2000h, light transmission attenuation <5%
Applications
Suitable for PV back encapsulation material for photovoltaic modules
Packaging
Coiled Packing is available. Outer packing is carton; inner packing is sealed. There is information such as product name, model, batch number and batch barcode, production date, and certification mark. directions for use, and the number of joints on the carton.
Coil specification: 1130mm (width is customizable)
Pallet specification: 200m coil, 3x3 per pallet; 600m coil is also available.
PV308C-BK PV Backsheet Material High Reflective Black Coating Design Reliable Quality
PV308C-BK TDS-EN.pdf
Black high reflective backsheet are self-developed by Huitian, which has high reflective and high highweather resistance of black fluorocarbon coating. lt is a wonderful choice as EVA bondinglayer in the CPC, PC and other structures of the solar cell backsheet.
Product Features
1) High weather resistance and heat resistant coating, no discoloration after long-term aging
2) Black high reflective design, a reliable choice for aesthetic modules
3) Self-developed, more cost-effective
Applications
Suitable for PV back encapsulation material for photovoltaic modules
Packaging
Coiled Packing is available. Outer packing is carton; inner packing is sealed. There is information such as product name, model, batch number and batch barcode, production date, and certification mark. directions for use, and the number of joints on the carton.
Coil specification: 985mm (width is customizable)
Pallet specification: 200m coil, 3x3 per pallet; 600m coil is also available.
PV310R-BK High Reflective Black Backsheet Single Sided Coating With Stable Color
PV310R-BK (fluoride-free) TDS-EN.pdf
PV310R-BK solar cell backsheet consists of a reinforced, biaxially oriented high barrier polyester film as the support and the weather-resistant layer, and a polyacrylic coating independently developed by Huitian as the EVA adhesive layer.
Product Features
1) High weather resistance and heat resistant coating, no discoloration after long-term aging
2) Black high reflective design, a reliable choice for aesthetic modules
3) Self-developed, more cost-effective
Applications
Suitable for PV back encapsulation material for photovoltaic modules
Packaging
Coiled Packing is available. Outer packing is carton; inner packing is sealed. There is information such as product name, model, batch number and batch barcode, production date, and certification mark. directions for use, and the number of joints on the carton.
Coil specification: 985mm (width is customizable)
Pallet specification: 200m coil, 3x3 per pallet; 600m coil is also available.