• 0113 Silicone Thermal Grease , Thermal Conductive Grease 0113 for CPU and LED chip , gap filling
0113 Silicone Thermal Grease , Thermal Conductive Grease 0113 for CPU and LED chip , gap filling

0113 Silicone Thermal Grease , Thermal Conductive Grease 0113 for CPU and LED chip , gap filling

Product Details:

Place of Origin: CHINA
Brand Name: HUITIAN
Certification: SGS
Model Number: 0113

Payment & Shipping Terms:

Minimum Order Quantity: 50KG
Price: Negotiation
Packaging Details: 2KG BUCKET
Payment Terms: L/C, T/T
Supply Ability: 1000KG MONTH
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Detail Information

Physical Form: Paste Color: White Or Black
Main Component: Polysiloxane Density: 2.9
Volatility(200℃,24h): 0.2% Work Temperature: -50~200
Heat Conductivity Coefficient: 2.1
High Light:

silicone thermal grease

,

high performance thermal compound

Product Description

0113 Silicone Thermal Grease , Thermal Conductive Grease 0113 for CPU and LED chip , gap filling

Product Features:

Ø Single component, white color.

Ø Physical form: paste

Ø Made of metallic oxide and polysiloxane

Ø Wide operating temperature range

Ø Nontoxic, non-corrosive

Ø Eco-friendly, odorless

Ø Doesn’t go dry and flowing at high temperature.

Ø High performance on insulation, damp proofing, corona resistance, electric leakage resistance and chemical resistance.

Ø Can be dispensed both by hand or machine.

Ø Heat conductivity coefficient: 2.1W/(m·K)

 

Technical Data:

Item Unit Typical Value
Item No.   0113
Physical Form   paste
Color   white
Main Component   polysiloxane
Density g/cm3 2.9
Penetration Degree 1/10cm 280
Volatility(200℃,24h) % 0.2
Volume Resistivity Ω*cm 1.0×1015
Dielectric Strength KV/mm 24
Breakdown Voltage KV/mm 20
Surface Resistance Ω 2.4×1014
0.1mm Thermal Resistance m2K/W 0.00011
Work Temperature -50~200
Heat Conductivity Coefficient W/(m·K) 2.1

 

Main Applications:

Ø Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.

Ø For the filling of gap between high-power audion, thyrister and basic materials such as copper and aluminum to reduce the temperature of electronic components.

How to Use

Ø Stir this product before using if it’s long time unused.

Ø Clean the object surfaces to get rid of oil and dirty before use.

Ø The object surfaces should be even and uniform.

Ø To dispense smoothly, please stir for 2 minutes before use.

Ø Apply a little for try before massive use.

Ø Only a thin layer of this product needed for use to avoid wastes.

Ø Do not keep this product exposed in the air for a long time.

 

Packing:

Ø 2kg/bucket, 6bukets/carton

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