0113 TDS-EN.pdf
0113 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.
Product Features:
One-component, white;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance, and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity: 2.1W/m·K
Main Applications:
Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.
To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.
| Item |
Unit |
Typical Value |
| Item No. |
|
0113 |
| Physical Form |
|
paste |
| Color |
|
white |
| Main Component |
|
polysiloxane |
| Density |
g/cm3 |
2.9 |
| Penetration Degree |
1/10cm |
280 |
| Volatility(200℃,24h) |
% |
0.2 |
| Volume Resistivity |
Ω*cm |
1.0×1015 |
| Dielectric Strength |
KV/mm |
24 |
| Breakdown Voltage |
KV/mm |
20 |
| Surface Resistance |
Ω |
2.4×1014 |
| 0.1mm Thermal Resistance |
m2K/W |
0.00011 |
| Work Temperature |
℃ |
-50~200 |
| Heat Conductivity Coefficient |
W/(m·K) |
2.1 |
Packing:
2kg/bucket, 6bukets/carton
Storage:
Store it in dry and cool places at the temperature of 0~35℃
Shelf life is 12 months
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