• 5295 Electrical Potting Compound for power supply , LED potting compound
  • 5295 Electrical Potting Compound for power supply , LED potting compound

    5295 Electrical Potting Compound for power supply , LED potting compound

    Product Details:

    Place of Origin: China
    Brand Name: Huitian
    Certification: UL,SGSL
    Model Number: 5295

    Payment & Shipping Terms:

    Minimum Order Quantity: 500 kg
    Price: Negotiation
    Packaging Details: 10KG/BUCKET
    Supply Ability: 200 TON MONTH
    Get Best Price Contact Now

    Detail Information

    Material: Silicone Color: Grey
    Density: 1.57 Viscosity: 3800
    Mix Ratio: 1:1 Handing Curing Time: 85 Mins
    Work Temperature: -60~200
    High Light:

    potting electronic components

    ,

    potting compound for electronic components

    Product Description

    5295 Electrical Potting Compound for power supply , LED potting compound

    5295 Potting Silicone for power supply and LED lamp

     

    Main Applications

    1.For the deep potting of power supply and electronic components and parts.

    2.Specially suitable for the potting of inside and outside LED displays that request for flame retardance.

    5295 two-component silicone compound


    ●INTRODUCTION
    ·5295 is a addition 2-part and flame retardant silicone compound.It is suitable for potting dense electronic component packages requiring heat dissipation as it has low viscosity and high thermal conductivity. This compound has excellent thermal stability, electrical properties, is compatible with most electrical insulating materials and has a UL 94 Flame Rating of 94 V-0,and it has large scope of heat resistance,the temp. could be from -60 to 250℃

     

    ●APPLICATIONS
    ·General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays

    5295 Electrical Potting Compound for power supply , LED potting compound 0

    Item Unit Typical Value
    Color Component A   Grey
    Component B   White
    Component of Basic Materials   Polysiloxane
    Density Component A g/cm3 1.57
    Component B 1.57
    Viscosity Component A mPa*s 3800
    Component B 3600
    After Mixed 3800
    Mix Ratio by weight (A:B)   1:1
    Handing Curing Time min 85
    Initial Curing Time hour 6
    Full Curing Time min(80°C) 25
    Thermal conductivity After Curing W/(m·K) 0.63
    Dielectric constant 1.2MHz 3.0
    Harness Shore A 65
    Volume Resistivity Ω*cm 1.5x1014
    Dielectric Strength KV/mm 21
    Work Temperature °C -60~20
     

     

     

     


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