0116 Silicone Thermal Grease 3.2W/M·K Gap Filler For CPU, IGBT, large storage devices, automotive electronics etc.

0116 TDS-EN.pdf

Product Description

• Silicone thermally conductive compound
• White paste
• Non-curing type

• Thermal conductivity: 3.2 W/ m·K
• Solvent-free, metal powder-free for insulation requirements
• Very small interface thickness and very low interface thermal resistance
• Low viscosity and proper thixotropy for fast large-area screen printing or hand-painting
• No residual stress after gluing effectively protects precision electronic components from damage

Typical applications

• Widely used as a heat transfer medium for electronic components, such as CPU, IGBT, automotive electronics, LED lighting, large storage devices, smartphone modules, consumer electronics, etc.

Directions for use

• It is recommended to pre-stir the product which has been placed for a long time before use.
• Test confirm with a sample before applying the product to the material.
• Before use, clean the surface to be applied and remove oil and dirt.
• The sizing surface should be even and consistent, as long as a thin layer is applied.
• To avoid being polluted by dust and other impurities, the product should not be exposed to the air for a long time.

​Technical parameters

Cautions

Keep away from children for storage.

On the premise of filling the gap, the thinner the coating, the better.

If the skin is accidentally exposed to the product, wipe clean and rinse with water.

If the eyes are accidentally exposed to the product, rinse immediately with plenty of water and seek medical examination.

Please consult the MSDS of the product for details.

Storage

Store at 8-28°C in a cool and dry place.

Shelf life is 12 months.

Packing specification

Order code: Shanghai, 011611;

Net weight 1000±5g